Summary of Key Component, Material, Process and Design Standards (USA)
|
Standard Organizations
The following documents on surface mount technology have been
developed by U.S. and international standards organizations.
The letter prefix of each document indicates the organization
responsible for that document.
|
| EIA |
-Electronic Industries Association |
| JEDEC |
-Joint Electron Devices Engineering
Council of the EIA |
| IPC |
-Institute for Interconnecting and
Packaging Electronic Circuits |
| MIL |
-Military |
| DoD |
-Department of Defense |
| J-STD |
-Joint Industry Standards |
Components, General
|
| EIA-886-E* |
Standard Test Methods for Passive
Electronic Component Parts - General Instructions and Index |
| EIA-481-A |
Taping of Surface Mount Components
for Automatic Placement |
| EIA-481-1 |
8mm and 12mm Taping of Surface Mount
Components for Automatic Handling |
| EIA-481-2 |
16mm and 24mm Embossed Carrier Taping
of Surface Mount Components for Automated Handling |
| EIA-481-3 |
32mm, 44mm, and 56mm Embossed Carrier
Taping of Surface Mount Components for Automated Handling |
| EIA/IS-47 |
Contact Termination Finish Standard
for Surface Mount Devices |
| EIA-PDP-100 |
Registered and Standard Mechanical
Outlines for Electronic Parts |
| EIA-JEP-95 |
JEDEC Registered and Standard Mechanical
Outlines for Semiconductor Devices |
| EIA-JESD30 |
Descriptive Designation System for
Semiconductor Device Packages |
| EIA-JESD95-1 |
Design Requirements for Outlines
of Solid-State and Related Products |
| IPC-3001 |
Component Qualification for the Assembly
Process |
| IPC-SM-786 |
Recommended Procedure for Handling
of Moisture Sensitive Plastic IC Packages
|
| |
* This document is an umbrella document
that consists of a series of uniform test methods for Electronic
Component Parts. |
Components, Passive Capacitors
|
| EIA-198-D |
Ceramic Dielectric Capacitors Classes
I, II, III, and IV |
| EIA-469-B |
Standard Test Method for Destructive
Physical Analysis of High Reliability Ceramic Monolithic Capacitors |
| EIA-479 |
Film-Paper, Film Dielectric Capacitors
for Microwave Ovens |
| EIA-510 |
Standard Test Method for Destructive
Physical Analysis of Industrial Grade Ceramic Monolithic Capacitors |
| EIA-535 |
Series of Detail Specifications on
Fixed Tantalum Capacitors that have been adopted by the National
Electronic Components Quality (NECQ) Assessment System |
| EIA-CB-11 |
Guidelines for the Surface Mounting
of Multilayer Ceramic Chip Capacitors |
| EIA/IS-28 |
Fixed Tantalum Chip Capacitor Style
1 Protected - Standard Capacitance Range |
| EIA/IS-29 |
Fixed Tantalum Chip Capacitor Style
1 Protected - Extended Capacitance Range |
| EIA/IS-35 |
Two-Pin Dual In-Line Capacitors |
| EIA/IS-36 |
Chip Capacitors, Multi-Layer (Ceramic
Dielectric) |
| EIA/IS-37 |
Multiple Layer High Voltage Capacitors
(Radial Lead Chip Capacitors) |
| EIA/IS-38 |
Radial Lead Capacitors (Conformally
Coated) |
| EIA/IS-39 |
Ceramic Dielectric Axial Capacitors
Glass Encapsulated) |
| IEC-384-3 |
Sectional Specification, Tantalum
Chip Capacitors |
| IEC-384-10 |
Sectional Specification, Fixed Multilayer
Ceramic Chip Capacitors |
| IECQ Draft |
Blank Detail Specification, Fixed
Multilayer Ceramic Chip Capacitors |
| IECQ-PQC-31 |
Sectional Specification, Fixed Tantalum
Chip Capacitors with Solid Electrolyte |
| IECQ-PQC-32 |
Blank Detail Specification, Fixed
Tantalum Chip Capacitor |
Resistors
|
| EIA-575 |
Resistors, Rectangular, Surface Mount,
General Purpose |
| EIA-576 |
Resistors, Rectangular, Surface Mount,
Precision |
| EIA/IS-34 |
Leaded Surface Mount Resistor Networks
Fixed Film |
Components, Active
|
| EIA-JEP-95 |
JEDEC Registered and Standard Outlines
for Semiconductor Devices |
| EIA-JESD11 |
Chip Carrier Pinouts Standardized
for CMOS 4000, HC, and HCT Series of Logic Circuits |
| EIA-JESD21-C |
Configurations for Solid State Memories |
| EIA-JESD22-B |
Test Methods and Procedures for Solid
State Devices Used in Transportation/Automotive Applications
Series format--consists of over 16 different test procedure
documents.) |
| EIA-JESD-26A |
General Requirements, PEM, Rugged
Environments |
| EIA-JESD30 |
Descriptive Designation System for
Semiconductor Device Packages |
| EIA-JESD95-1 |
Design Requirements for Outlines
of Solid-State and Related Products |
Components, Electromechanical Connectors
|
| EIA-429 |
Industry Standard for Connectors,
Electrical Flat Cable Type (IPC-FC-218B) |
| EIA-364-B |
Electrical Connector Test Procedures
Including Environmental Classifications (Series format consisting
of over 60 Electrical Connector test procedures.) |
| EIA-506 |
Dimensional and Functional Characteristics
Defining Sockets for Leadless Type A Chip Carriers (.050 Spacing) |
| EIA-507 |
Dimensional Characteristics Defining
Edge Clips for Use with Hybrid and Chip Carriers |
| EIA/IS-47 |
Contact Termination Finish Standard
for Surface Mount Devices |
| EIA/IS-64 |
Two Millimeter, Two-Part Connectors
for Use with Printed Boards and Backplanes |
Sockets
|
| EIA-5400000 |
Generic Specification for Sockets
for Integrated Circuit (IC) Packages for Use in Electronic
Equipment (Series format with over 20 Sectional, Blank Detail
& Detail Specifications, approved for use in the NECQ
System.) |
Switches
|
| IECQ-PQC-41 |
Detail Specification, Dual-in-Line
Switch, Surface |
| -US00003 |
Mountable, Slide Actuated |
| EIA-448-23 |
Surface Mountable Switches, Qualification
Test |
| EIA-5200000-A |
Generic Specification for Special-Use
Electromechanical Switches of Certified Quality (Series format
with over 25 Sectional, Blank Detail & Detail Specifications,
approved for use in the NECQ System.) |
Printed Boards
|
| IPC-FC-250 |
Performance Specification for Single
and Double-sided Flexible Printed Boards |
| IPC-RF-245 |
Performance Specification for Rigid-Flex
Multilayer Printed Boards |
| IPC-RB-276 |
Performance Specification for Rigid
Printed Boards |
| IPC-MC-324 |
Performance Specification for Metal
Core Boards |
| IPC-HM-860 |
Performance Specification for Hybrid
Multilayer |
| IPC-6301 |
Performance Specification for Organic
Multichip Module Structures (MCM-L) |
| MIL-P-50884 |
Military Specification Printed Wiring,
Flexible, and Rigid Flex |
| MIL-P-55110 |
Military Specification Printed Wiring
Boards, General Specification For |
| IPC-DW-425/424 |
Discrete Wiring Technology |
| MIL-P-RRRRR |
Printed Circuit Board/Printed Wiring
Board Manufacturing, General Specification For |
Materials
|
| IPC-L-108B |
Specification for Thin Metal Clad
Base Materials for Multilayer Printed Boards |
| IPC-L-109B |
Specification for Resin Preimpregnated
Fabric (Prepreg) for Multilayer Printed Boards |
| IPC-CC-110 |
Guidelines for Selecting Core Constructions
for Multilayer Printed Wiring Board Applications |
| IPC-L-115B |
Specification for Rigid Metal Clad
Base Materials for Printed Boards |
| IPC-CF-148 |
Resin Coated Metal for Multilayer
Printed Boards |
| IPC-MF-150F |
Metal Foil for Printed Wiring Applications |
| IPC-CF-152 |
Metallic Foil Specification for Copper/Invar/Copper
(CIC) for Printed Wiring and Other Related Applications |
| IPC-SM-817 |
General Requirements for SMT Adhesives |
| IPC-CC-830 |
Qualification and Performance of
Electrical Insulation Compounds for Printed Board Assemblies |
| IPC-SM-840 |
Qualification and Performance of
Permanent Polymer Coating (Solder Mask) for Printed Boards |
| J-STD-004 |
Requirements for Soldering Fluxes |
| J-STD-005 |
General Requirements and Test Methods
for Electronic Grade Solder Paste |
| J-STD-006 |
General Requirements and Test Methods
for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Solders
for Electronic Soldering Applications |
Design Activities
|
| IPC-D-249 |
Design Standard for Flexible Single
and Double-sided Printed Boards |
| IPC-D-275 |
Design Standard for Rigid Printed
Boards and Rigid Printed Board Assemblies |
| IPC-D-279 |
Reliability Design Guidelines for
Surface Mount Technology Printed Board Assemblies |
| IPC-D-317 |
Design Standard for Electronic Packaging
Utilizing High Speed Techniques |
| IPC-C-406 |
Design and Application Guidelines
for Surface Mount Connectors |
| IPC-SM-782 |
Surface Mount Land Patterns (Configuration
and Design Rules) |
| IPC-H-855 |
Hybrid Microcircuit Design Guide |
| IPC-D-859 |
Design Standard for Multilayer Hybrid
Circuits |
| IPC-2301 |
Design Standard for Organic Multichip
Modules(MCM-L) and MCM-L Assemblies |
| MIL-STD-2118 |
Design Standard for Flexible Printed
Wiring |
Component Mounting
|
| EIA-CB-11 |
Guidelines for the Surface Mounting
of Multilayer Ceramic Chip Capacitors |
| IPC-CM-770 |
Guidelines for Printed Board Component
Mounting |
| IPC-SM-784 |
Guidelines for Direct Chip Attachment |
| SMC-TR-001 |
An Introduction to Tape Automated
Bonding and Fine Pitch Technology |
| IPC-SM-780 |
Electronic Component Packaging and
Interconnection with Emphasis on Surface Mounting |
| J-STD-012 |
Implementation of Flip Chip and Scale
Chip Technology |
| J-STD-013 |
Implementation of Ball Grid Array
and other High Density Technology |
Soldering and Solderability
|
| EIA/IS-46 |
Test Procedure for Resistance to
Soldering (Vapor Phase Technique) for Surface Mount Devices |
| EIA/IS-49-A |
Solderability Test Method for Leads
and Terminations |
| EIA-448-19 |
Method 19 Test Standard for Electromechanical
Components Environmental Effects of Machine Soldering Using
a Vapor Phase System |
| IPC-TR-460A |
Trouble Shooting Checklist for Wave
Soldering Printed Wiring Boards |
| IPC-TR-462 |
Solderability Evaluation of Printed
Boards with Protective Coatings Over Long-term Storage |
| IPC-TR-464 |
Accelerated Aging for Solderability
Evaluations |
| J-STD-001 |
Requirements for Soldered Electrical
and Electronic Assemblies |
| J-STD-002 |
Solderability Tests for Component
Leads, Terminations, Lugs, Terminals and Wires |
| J-STD-003 |
Solderability Tests of Printed Boards |
| IPC-S-816 |
Troubleshooting for Surface Mount
Soldering |
| IPC-AJ-820 |
Assembly and Joining Handbook |
Quality Assessment
|
| EIA-469-B |
Standard Test Method for Destructive
Physical Analysis of High Reliability Ceramic Monolithic Capacitors |
| EIA-510 |
Standard Test Method for Destructive
Physical Analysis of Industrial Grade Ceramic Monolithic Capacitors |
| IPC-A-600 |
Acceptability of Printed Boards |
| IPC-A-610 |
Acceptability of Printed Board Assemblies |
| MIL-STD-883 |
Methods and Procedures for Microelectronics |
| IPC-TR-551 |
Quality Assessment of Printed Boards
Used for Mounting and Interconnecting Electronic Components
Reliability |
| IPC-A-24 |
Flux/Board Interaction Board |
| IPC-A-36 |
Cleaning Alternatives Artwork |
| IPC-A-38 |
Fine Line Round Robin Test Pattern |
| IPC-A-48 |
Surface Mount Artwork |
| IPC-AI-640 |
User Requirements for Automatic Inspection
of Unpopulated Thick Film Hybrid Substrates |
| IPC-AI-641 |
User Guidelines for Automated Solder
Joint Inspection Systems |
| IPC-AI-642 |
User Guidelines for Automated Inspection
of Artwork and Innerlayers |
| IPC-AI-643 |
User Guidelines for Automatic Optical
Inspection of Populated Packaging and Interconnection |
Surface Mount Process
|
| IPC-SC-60 |
Post Solder Solvent Cleaning Handbook |
| IPC-SA-61 |
Post Solder Semi Aqueous Cleaning
Handbook |
| IPC-AC-62 |
Post Solder Aqueous Cleaning Handbook |
| IPC-TR-580 |
Cleaning and Cleanliness Test Program
Phase 1 Test Results |
| IPC-SM-785 |
Guidelines for Accelerated Surface
Mount Attachment Reliability Testing |
Numerical Control Standards
|
| IPC-NC-349 |
Computer Numerical Formatting for
Drilling and Routing Equipment |
| IPC-D-350D |
Printed Board Description in Digital
Form - } |
| IEC-1182-1 |
Printed Board Description in Digital
Form - } Companion Documents |
| IPC-D-351 |
Printed Wiring Documentation in Digital
Form |
| IPC-D-352 |
Electronic Design Database Description
for Printed Boards |
| IPC-D-354 |
Library Format Description for Printed
Boards in Digital Form |
| IPC-D-356 |
Bare Board Electrical Test Information
in Digital Form |
| EIA-224-B |
Character Code for Numerical Machine
Control Perforated Tape |
| EIA-227-A |
One-Inch Perforated Tape |
| EIA-267-B |
Axis and Motion Nomenclature for
Numerically Controlled Machines |
| EIA-274-D |
Interchangeable Variable Block Data
Format for Positioning, Contouring, and Contouring/Positioning
Numerically Controlled Machines |
| EIA-281-B |
Electrical and Construction Standards
for Numerical Machine Control |
| EIA-358-B |
Subset of American National Standard
Code for Information Interchange for Numerical Machine Control
Perforated Tape |
| EIA-408 |
Interface Between Numerical Control
Equipment on Data Terminal Equipment Employing Parallel Binary
Data Interchange |
| EIA-431 |
Electrical Interface Between Numerical
Control and Machine Tools |
| EIA-441 |
Operator Interface Function of Numerical
Controls |
| EIA-474 |
Flexible Disk Format for Numerical
Control Equipment Information Interchange |
| EIA-484 |
Electrical and Mechanical Interface
Characteristics and Line Control Protocol Using Communication
Control Characters for Serial Data Link Between a Direct Numerical
Control System and Numerical Control Equipment Employing Asynchronous
Full Duplex Transmission |
| EIA-494 |
32 BIT Binary CL Exchange (BCL) Input
Format for Numerically Controlled Machines |
Test Methods
|
| EIA-JEDEC |
Method B 105-A, Lead Integrity -
Plastic Leaded Chip Carrier (PLCC) Packages |
| EIA-JEDEC |
Method B 102, Surface Mount Solderability
Test(JESD22-B) |
| EIA-JEDEC |
Method B 108, Coplanarity (intended
for inclusion into JESD 22-C) |
| IPC-TM-650 |
Test Methods Manual |
Repair
|
| IPC-R-700C |
Guidelines for Repair and Modification
of Printed Board Assemblies |
Terms and Definitions
|
| IPC-T-50E |
Terms and Definitions for Interconnecting
and Packaging Electronic Circuits |
How to Obtain These Documents
Following are addresses for the IPC, EIA and other sources
for documents shown in this SMT listing:
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|
INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC
CIRCUITS (IPC)
2215 Sanders Road, Ste. 250
Northbrook, IL 60062-6135
Phone: 708-509-9700
Fax: 708-509-9798
ELECTRONIC INDUSTRIES ASSOCIATION (EIA)
2001 Pennsylvania Avenue, NW
Washington, DC 20006-1813
Phone: 703-907-7500
Fax: 703-907-7501
GLOBAL ENGINEERING DOCUMENTS
2805 McGaw Avenue
Irvine, CA 92713
Phone: 1-800-854-7179
Fax: 314-726-6418
Military documents are available from:
STANDARDIZATION DOCUMENTS
Order Desk, Building 4D
700 Robbins Avenue
Philadelphia, PA 19111-5094
Tel.: 215-697-2667
Central Office of the IEC:
INTERNATIONAL ELECTROTECHNICAL COMMISSION (IEC)
3 Rue de Varembe
1211 Geneva 20, Switzerland
IEC documents are available from:
AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)
11 West 42nd Street
New York, NY 10036
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