|
SJ/T 10668-1995
|
表面贴装技术术语Terminology
for surface mount technology
|
|
SJ/T 10670-1995
|
表面组装工艺通用技术要求General
requirements for workmanship of surface mount technology
|
|
SJ/T 10669-1995
|
表面组装元器件可焊性试验Solderability
tests for surface mounted devices
|
|
SJ/T 10666-1995
|
表面组装组件的焊点质量评定Quality
assessment of soldered joints of SMA
|
|
SJ/T XXXX-XXXX
|
表面组装用胶粘剂通用规范(报批稿)General
requirements for surface mounting adhesives
|
|
SJ/T XXXX-XXXX
|
锡铅膏状焊料(报批稿)Soldering
paste
|
|
SJ/T 10534-1994
|
波峰焊接技术要求Requirements
for wave soldering
|
|
SJ/T 10565-1994
|
印制板组装件装联要求Accepability
technical requirements of printed board assembly
|
|
SJ/T 10532-1994
|
工业管理Technological
management
|
|
SJ/T 10533-1994
|
电子设备制造防静电技术要求
|
|
SJ/T 10630-1995
|
电子元器件制造防静电技术要求
|
|
SJ/T 10694-1996
|
电子产品制造防静电系统测试方法
|
