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ROHS最新豁免条例分享
2008年08月14日点击: 编辑: tigeracl
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Code    Exemption
1    Mercury in compact fluorescent lamps:
not exceeding 5 mg per lamp
2    Mercury in straight fluorescent lamps for general purposes
not exceeding 10 mg halophosphate
not exceeding 5 mg triphosphate (normal lifetime)
not exceeding 8 mg triphosphate (long lifetime)

3    Mercury in straight fluorescent lamps for special purposes
4    Mercury in other lamps not specifically mentioned in this Annex
5    Lead in glass of cathode ray tubes, electronic components & fluorescent tubes.
6    Lead as an alloying element:
in steel containing up to 0.35% lead by weight
in aluminium containing up to 0.4% lead by weight
in copper containing up to 4% lead by weight
7    Lead in high melting temperature type solders
(lead-based alloys containing 85% by weight or more lead)
   Lead in solders
for servers, storage and storage array systems
for telecommunications network infrastructure equipment
(switching, signaling, transmission, network management)
   Lead in electronic ceramic parts
(piezoelectronic devices)
8    Cadmium/compounds in electrical contacts and cadmium plating
except for applications banned under Directive 91/338/EEC
relating to restrictions on the marketing and use of
certain dangerous substances and preparations
9    Hexavalent chromium as an anti-corrosion
of the carbon steel cooling system in absorption refrigerators
9a    DecaBDE in polymeric application
Exemption ends July 1, 2008

9b    Lead in lead-bronze bearing shells and bushes

10    Light bulbs (being investigated)
11    Lead used in compliant pin connector systems
12    Lead as a coating material
for the thermal conduction module c-ring
13    Lead and cadmium in optical and filter glass
14    Lead in solders consisting of more than two elements
for the connection between pins and package of microprocessors
with lead content of more than 80% and less than 85% by weight
15    Lead in solders to complete a viable electrical connection
between semiconductor die and carrier
within integrated circuit Flip Chip packages
16    Lead in linear incandescent lamps with silicate coated tubes
17    Lead halide as radiant agent
in High Intensity Discharge (HID) lamps
used for professional reprography
18a    Lead as an activator in the fluorescent powder
(1% lead by weight or less)
of discharge lamps containing phosphors such as BSP
used for sun tanning lamps
18b    Lead as an activator in the fluorescent powder
(1% lead by weight or less)
of specialty lamps containing phosphors such as SMS
used for diazo-printing reprography, lithography, photochemical processes, curing processes, and insect traps
19    Lead
with PbBiSn-Hg in specific compositions as main amalgam
with PbInSn-Hg in specific compositions as main amalgam
with PbSn-Hg as auxiliary amalgam
used in very compact Energy Saving Lamps (ESL)
20    Lead oxide in glass
used for bonding front & rear substrates of flat fluorescent lamps
in Liquid Crystal Displays (LCD)
21    Lead and cadmium in printing inks
for the application of enamels on borosilicate glass
22    Lead as impurity in RIG Faraday rotators (rare earth iron garnet)
used for fibre optic communications systems
23    Lead in finishes of fine pitch components other than connectors
with a pitch of 0.65 mm or less
with NiFe lead frames or copper lead frames
24    Lead in solders for the soldering to
machined through hole discoidal or planar array
ceramic multilayer capacitors
25    Lead oxide in plasma display panels (PDP)
or surface conduction electron emitter displays (SED)
used in structural elements
(front & rear glass dielectric layer, bus electrode, black stripe, address electrode, barrier ribs, seal frit & frit ring)
and in print pastes
26    Lead oxide in the glass envelope
of black light blue (BLB) lamps
27    Lead alloys as solder for transducers
used in high-powered loud speakers
(operate at acoustic power levels of 125 dB SPL & above)
28    Hexavalent chromium in corrosive preventive coatings
of unpainted metal sheetings and fasteners used for
corrosion protection and electromagnetic interference shielding
in IT and telecommunications equipment

(exemption granted until July 1, 2007)
29    Lead bound in crystal glass
Categories 1, 2, 3 and 4 of Directive 69/493/EEC

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